Product Specifications
Product
Cantilever
Muliti-site
Blade Cards
Low Leakage
In-line
Diagonal
Ceramic
Ceramic
Staggered
In-line
Metal
Agilent 4070/4062 series
BGA
Shelf
Transmission
Butterfly
Specifications
Minimum Pad Pitch
Minimum Bond Pad
Probe Tip Depth*
45um in line
<45um square
80-350 +/-5
35/70um staggered
*Probe tip depth is measured from probe tip to the bottom of the PCB This is dependent on temperature and probe layer count
Rings
Size
Shape
Temperature
Aluminum
Plastic
Ceramic
Die Dependent
Die Dependent
Die Dependent
Die Dependent
Die Dependent
Die Dependent
Ambient
Ambient
High Temperature
Probe Materials
Tungsten
Rhenium Tungsten (Rh Tungsten)
Beryllium Copper (BeCu)
Paliney7™
Newtek™
Hardest probe material, fibrous in nature, often used on Aluminum Pads
Not as fibrous as Tungsten, often used on Aluminum Pads
Low contact Resistance, softer then Rh or Tungsten probes, used on Gold or Copper Pads
Low contact Resistance, harder then BeCu, used on Gold Pads
Low stable contact resistance often used on Aluminum over Copper Pads
Misc. Specs.
Tip Diameter
Tip Length
Wire Diameter
Epoxy
Edge Sensor
.5-4.0 +/-.2 mils
5-36 +/.1mils
4-15 mils
Ambient up to 150° C
High temp 150° C- 200º C
Low Leakage
2 wire
2 wire isolated
3 wire isolated
Electrical Specifications on Probe Card Analyzer
Balance Contact Force (BCF)
Planarity and Alignment
Contact Resistance
Leakage
1.2-3.0 +/-20% gm.mil of overdrive**
+/-0.25 mils for flat pads
Measured <2 ohms at 25mA
10nA @ 5V -Standard
<5pA @ 100V- Low Leakage
**Dependent on overall design of ring, pad pitch, pad size and wafer material
Printed Circuit Board Materials
High temp FR4 (Polyclad 370)
Gtek™
Nelco High Performance (N4000-13)
Polyimide
Rogers™
Mixed Dielectrics
Flatness 5.0 mils per linear Inch