Cantilever

Using Cantilever technology with small to high pin count shipping probe cards in excess of 1500 probes per device, Rucker Kolls provides the options of multi-site, high temperature, bump, tight pad pitch, low leakage, and RF applications.

Cost-effective probing solutions
Optimized for long term use
Low to High pin count
Pad Pitch in line- 45 micron; staggered 35/70 microns
High temperature applications available
Bump/Array Probing
Applied Precision Probe Card Analyzer
Equipped Quality Assurance department

PROBE CARD SPECIFICATIONS

Minimum Pad Pitch: 45um in-line, 35/70um staggered

Minimum Bond Bad: <45um square

Electrical Specifications Measured on Probe Card Analyzer

Planarity and Alignment: +/-0.25 mils for flat pads
Contact Resistance Measured: <2 ohms at 25mA
Standard Leakage 10nA @ 5V

Probe Tip Depth: Probe depth is measured from probe tip to the bottom of the PCB 80-350 mils +/-5 mils. (This is dependent on temperature and probe layer count)

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Tip Diameter: +/-.2 mils

Tip Length: +2/-1 mil

Edge Sensor: 2 wire, 2 wire isolated, 3 wire isolated

Edge Sensor Resistance: 1.0Ω max between the sensor probe and the switch

Probing Temperature: Ambient up to 150º C, High Temp 151°- 200º C

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Probe Material:

Tungsten
Rhenium Tungsten (RhTungsten)
Hardened Beryllium Copper (HBeCu)
Beryllium Copper (BeCu)
Paliney7™
Newtek™

PCB Design and Fabrication

Printed Circuit Boards Materials:

High Temp FR4 (Polyclad 370)
Gtek™
Nelco High Performance (N4000-13)
Polyimide
Rogers™
Mixed Dielectrics
Flatness 5.0 mils per linear inch

BCF measurements available upon request