| Product |
|
|
|
|
| Cantilever |
In-line |
Staggered |
BGA |
Butterfly |
| Muliti-site |
Diagonal |
In-line |
Shelf |
|
| Blade Cards |
Ceramic |
Metal |
Transmission |
|
| Low Leakage |
Keithly |
Agilent 4070/4062 series |
|
|
| Specifications |
|
|
|
|
| Minimum Pad Pitch |
45um in line |
35/70um staggered |
|
|
| Minimum Bond Pad |
<45um square |
|
|
|
| Probe Tip Depth* |
80-350 +/-5 |
|
|
|
| Rings |
Size |
Shape |
Temperature |
|
| Aluminum |
Die Dependent |
Die Dependent |
Ambient |
|
| Plastic |
Die Dependent |
Die Dependent |
Ambient |
|
| Ceramic |
Die Dependent |
Die Dependent |
High Temperature |
| Probe Materials |
|
|
|
|
| Tungsten |
Hardest probe material, fibrous in nature,
often used on Aluminum Pads |
| Rhenium Tungsten (Rh Tungsten) |
Not as fibrous as Tungsten,
often used on Aluminum Pads |
| Beryllium Copper (BeCu) |
Low contact Resistance,
softer then Rh or Tungsten probes, used on Gold or Copper Pads |
| Paliney7™ |
Low contact Resistance,
harder then BeCu, used on Gold Pads |
| Newtek™ |
Low stable contact resistance often
used on Aluminum over Copper Pads |
| Misc. Specs. |
|
|
|
| Tip Diameter |
.5-4.0 +/-.2 mils |
|
|
| Tip Length |
5-36 +/.1mils |
|
|
| Wire Diameter |
4-15 mils |
|
|
| Epoxy |
Ambient up to 150° C
High temp 150° C- 200º C
Low Leakage |
|
| |
|
| Edge Sensor |
2 wire
2 wire isolated
3 wire isolated |
|
|
| |
|
|
| Electrical
Specifications on
Probe Card Analyzer |
|
|
| Balance Contact Force (BCF) |
1.2-3.0 +/-20% gm.mil of overdrive** |
| Planarity and Alignment |
+/-0.25 mils for flat pads |
|
| Contact Resistance |
Measured <2 ohms at 25mA |
|
| |
10nA @ 5V -Standard |
|
| Leakage |
<5pA @ 100V- Low Leakage |
|
| Printed Circuit Board Materials |
|
|
|
High temp FR4 (Polyclad 370)
Gtek™
Nelco High Performance (N4000-13)
Polyimide
Rogers™
Mixed Dielectrics
Flatness 5.0 mils per linear Inch |
|
|
|
|
