Cantilever | Multi-site | Butterfly | Blades | Low Leakage | Custom PCB Design | Card Stiffeners/Rings | Specs. | Equip. | Spares

Shelf Technology

Shelf Technology saves our customers both money and time through our optimum multi-site configuration allowing more die to be tested in a shorter time with a reduction in touchdowns.

  • Multi-site configuration
  • Uniform beam length optimizes control of balance contact force (BCF)
  • Minimum to no probe fan-out
  • Consistent small Inline probe scrub reduces yield loss
  • Option of 1x2, 2x2, 2x3, 2x4, etc. for more efficient probe mapping

Butterfly

Innovation and experience in probe card assembly runs deep at Rucker & Kolls. Not only does the Butterfly™ design provide a cost-effective solution for multi-DUT applications, but it has solved several problems inherent in Shelf- type probe cards.

  • Achieves higher yield with minimum expense
  • No need to change existing test equipment
  • Fewer probe tiers for better alignment and planarity
  • All scrub marks travel in same direction
  • Planarity and alignment do not drift after extended use
  • Options of 1x2, 2x2, 2x3, 2x4, etc. for more efficient probe mapping
  • 60 micron pad pitch
  • Can be designed to use a generic PCB
  • Uniform beam length optimizes control of BCF

 

 

 

 

PROBE CARD SPECIFICATIONS

Minimum Pad Pitch: 50um in-line, 35/70um staggered

Minimum Bond Bad: <45um square

Electrical Specifications Measured on Probe Card Analyzer

  • Planarity and Alignment: +/-0.25 mils for flat pads
  • Contact Resistance Measured: <2 ohms at 25mA
  • Standard Leakage 10nA @ 5V

Probe Tip Depth: Probe depth is measured from probe tip to the bottom of the PCB 80-350 mils +/-5 mils. (This is dependent on temperature and probe layer count)

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Tip Diameter: +/-.2 mils

Tip Length: +2/-1 mil

Edge Sensor: 2 wire, 2 wire isolated, 3 wire isolated

Edge Sensor Resistance: 1.0Ω max between the sensor probe and the switch

Probing Temperature: Ambient up to 85º C, High Temp 86°- 150ºC, Ultra-High Temp 151-200C

Probe Material:

  • Tungsten
  • Rhenium Tungsten (RhTungsten)
  • Hardened Beryllium Copper (HBeCu)
  • Beryllium Copper (BeCu)
  • Paliney7™
  • Newtek™

Printed Circuit Boards Materials:

  • High Temp FR4 (Polyclad 370)
  • Gtek™
  • Nelco High Performance (N4000-13)
  • Polyimide
  • Rogers™
  • Mixed Dielectrics
  • Flatness 5.0 mils per linear inch

PCB Design and Fabrication

BCF measurements available upon request

Copyright © 2007 Rucker & Kolls Inc. 
Rucker & Kolls, the Rucker & Kolls logo and Butterfly design are trademarks or registered trademarks of Rucker & Kolls Inc.
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