PROBE CARD SPECIFICATIONS

Minimum Pad Pitch: 45um in-line, 35/70um staggered

Minimum Bond Bad: <45um square

Electrical Specifications Measured on Probe Card Analyzer

• Planarity and Alignment: +/-0.25 mils for flat pads
• Contact Resistance Measured: <2 ohms at 25mA
• Standard Leakage 10nA @ 5V

Probe Tip Depth: Probe depth is measured from probe tip to the bottom of the PCB 80-350 mils +/-5 mils. (This is dependent on temperature and probe layer count)

Balance Contact Force (BCF): 1.2 to 3.0 gm/mil of overdrive (Dependent on overall design of ring, pad pitch and pad size)

Tip Diameter: +/-.2 mils

Tip Length: +2/-1 mil

Edge Sensor: 2 wire, 2 wire isolated, 3 wire isolated

Edge Sensor Resistance: 1.0Ω max between the sensor probe and the switch

Probing Temperature: Ambient up to 150º C, High Temp 151°- 200º C

Probe Material:

• Tungsten
• Rhenium Tungsten (RhTungsten)
• Hardened Beryllium Copper (HBeCu)
• Beryllium Copper (BeCu)
• Paliney7™
• Newtek™

Printed Circuit Boards Materials:

• High Temp FR4 (Polyclad 370)
• Gtek™
• Nelco High Performance (N4000-13)
• Polyimide
• Rogers™
• Mixed Dielectrics
• Flatness 5.0 mils per linear inch

PCB Design and Fabrication

BCF measurements available upon request